File:B-ad-bcbprocessflow.png

DescriptionB-ad-bcbprocessflow.png	Schematic process flow of dry etch and photosensitive BCB wafer bonding technique.
Date	30 March 2011, 10:53 (UTC)
Source	J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003)
Author	Fraunhofer ENAS, D. Neumann
Permission (Reusing this file)	This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS You are free: to share – to copy, distribute and transmit the work to remix – to adapt the work Under the following conditions: attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use. share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original. CC BY-SA 3.0 detruetrue

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