File:Wirebonding.svg
Summary
Description |
Cyril BUTTAY Sketch showing the internal connections of a Power transistor package (D2PAK type). The drain connection is made via the copper pad on the bottom of the silicon die. |
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Date | 30 March 2006 (original upload date) | |||
Source | No machine-readable source provided. Own work assumed (based on copyright claims).Category:Assumed own work | |||
Author | No machine-readable author provided. CyrilB~commonswiki assumed (based on copyright claims). Category:Files with no machine-readable source | |||
Other versions |
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SVG development |
Licensing
I, the copyright holder of this work, hereby publish it under the following licenses:
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Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License. |
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This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Unported license. | |
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This licensing tag was added to this file as part of the GFDL licensing update. |
This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic license.
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You may select the license of your choice.
Category:Assumed own work
Category:CC-BY-SA-2.5,2.0,1.0
Category:CC-BY-SA-3.0-migrated
Category:Files with no machine-readable source
Category:GFDL
Category:Invalid SVG created with Inkscape:Diagrams
Category:Librsvg bug replaced by vector graphic
Category:License migration redundant
Category:Pictures showing a librsvg bug (SVG replaced)
Category:Power electronic diagrams
Category:Self-published work
Category:Wire bonding